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Fleck Research Databases

The core business of Fleck Research is connectors, cable assemblies, backpanels and related interconnect devices. Accordingly, Fleck Research has created extensive databases for this segment of the electronics industry.

These databases can be subdivided into 40 basic areas.

Highlights of

Product Lines
Region
Suppliers
High-Speed
Markets
Equipment
Pricing

Section A: Listing of the 40 basic databases

I. Product lines subdivided by design type
  1. Connector product lines subdivided by design type
  2. Backplane product lines subdivided by design type
  3. Cable assembly product lines subdivided by design type
  4. Interconnect device product lines subdivided by design type
   
II. High-volume and high-growth product lines subdivided by design type.
  5. Connector product lines (high-volume and high-growth) subdivided by design type
  6. Backplane product lines (high-volume and high-growth) subdivided by design type
  7. Cable assembly product lines (high-volume and high-growth) subdivided by design type
  8. Interconnect device product lines (high-volume and high-growth) subdivided by design type
   
III. Product Lines subdivided by design type by region of the world, design types, high-volume and high-growth.
 

9. North America, design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type

  10. Europe, design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  11. Japan, design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  12. Pacific Rim, design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  13. ROW (Rest of World), design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
   
IV. Product Lines subdivided by country of the world.
  14. North America (U.S. and Canada), design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  15. European countries (Germany, France, U.K., Italy, Sweden, Denmark, Norway, Finland, Benelux, Spain, Switzerland), design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  16. Pacific Rim countries (Taiwan, South Korea, Singapore, Malaysia, Thailand, Indonesia, Philippines, India, Australia, New Zealand), design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  17. China (Mainland China) design types, high volume and high growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
  18. R.O.W. countries (Mexico, Central America, Brazil, South America, Soviet Union satellites, Israel, Middle East), design types, high-volume and high-growth
     - Connector product lines subdivided by design type
     - Backplane product lines subdivided by design type
     - Cable assembly product lines subdivided by design type
     - Interconnect device product lines subdivided by design type
   
V. Suppliers (manufacturers of connectors, cable assemblies and backplanes)
       - Worldwide
     - North America
     - Europe
     - Japan
     - China
     - Pacific Rim
   
VI. Suppliers (manufacturers) by demand sector
       - Worldwide
     - North America
     - Europe
     - Japan
     - Pacific Rim
   
VII. Expanded analysis of suppliers (manufacturers)
       - Market share by region of the world
     - Market share by demand sector
     - Market share by product category
     - Market share by product design type
   
VIII. Industry performance (connectors, cable assemblies and backplanes) by quarter
   
IX. Impact of acquisitions and mergers
       - Manufacturers of connectors, cable assemblies and backplanes
     - Electronic distributors who resale connectors, cable assemblies and backplanes
   
X. Level 1,2,3,4,5 Databases
  Level 1 is defined as the interconnections between the wafer, bare die, bare die attachment and to the substrate or MCM. Level 2 is defined as the interconnections from the semiconductor device to the substrate or board. Level 3 is defined as interconnections from board-to-board. Level 4 is defined as interconnections from wire-to-board. Level 5 is defined as interconnections which are wire-to-wire.
   
XI. High Speed Digital Signal Databases
  (High speed digital signals are defined as 1 GHz and above with pulse rise times below 100 ps.)
   
XII. High Density Product Line Databases
  (High density connectors are defined as those with pin pitches of 1.27mm and below including 1.0mm, 0.8mm, 0.635mm, 0.5mm, 0.4mm, 0.3mm and pin pitches in the micron area.)
   
XIII. Five-year growth rates for product lines by design type
  19. Connector product lines subdivided by design type
20. Backplane product lines subdivided by design type
21. Cable assembly product lines subdivided by design type
22. Interconnect device product lines subdivided by design type
   
XIV. Product lines subdivided by design type by demand sector
  23. Computer
24. Telecom
25. Communication/Wireless
26. Datacom
27. Military Electronics
28. Automotive
29. Test & Measurement
30. Consumer Electronics
31. Commercial Aircraft
32. Industrial Electronics
33. Medical
34. Other
   
XV. Product lines subdivided by design type by demand sector by region of the world
  35. North America
36. Europe
37. Japan
38. Pacific Rim
39. ROW (Rest of World)
   
XVI. Demand sectors subdivided by type of electronic equipment
  40. Computer subdivided by type of equipment
41. Telecom subdivided by type of equipment
42. Communication/Wireless subdivided by type of equipment
43. Datacom subdivided by type of equipment
44. Military Electronics subdivided by type of equipment
45. Automotive subdivided by type of equipment
46. Test & Measurement subdivided by type of equipment
47. Consumer Electronics subdivided by type of equipment
48. Commercial Aircraft subdivided by type of equipment
49. Industrial Electronics subdivided by type of equipment
50. Medical subdivided by type of equipment
51. Office Automation subdivided by types of equipment
52. Other subdivided by type of equipment
   
XVII. Demand sectors by prior history
  53. 2004
54. 2003
55. 2002
56. 2001
   
XVIII. Technology trends within electronic systems/equipment and impact on connectors, cable assemblies and backplanes.
  57. Computer
58. Telecom
59. Communication/Wireless
60. Datacom
61. Military Electronics
62. Automotive
63. Test & Measurement
64. Consumer Electronics
65. Commercial Aircraft
66. Industrial Electronics
67. Medical
68. Other
69. Technology Roadmaps of OEMs on the leading edge of technology
70. Advanced Electronic Packaging
71. Impact of Technology upon Connector Development
72. High Speed Digital Signals
73. High Density Connectors (1.27mm and below)
   
XIX. Impact of electronic technology trends upon connector design
   
XX. Technological trends of major OEMs
   
XXI. Application of connectors by type of electronic equipment
  74. Numerous databases describing the type of connectors utilized in a specific electronic system/component.
   
XXII. OEM customer accounts purchasing connectors, cable assemblies and backplanes
  75. Contract electronic manufacturers (CEMs).
76. Computer OEM accounts
77. Telecom OEM accounts
78. Communication/Wireless OEM accounts
79. Datacom OEM accounts
80. Military/Aerospace OEM accounts
81. Medical OEM accounts
82. Automotive OEM accounts
83. Electrical/Non-electrical OEM accounts
   
XXIII. Pricing database
  84. Average, high and low prices among Pacific Rim and American suppliers for connectors and cable assemblies.
   
XXIV. Units of connectors and connector components
  85. Units of connector assemblies.
86. Units of insulators.
87. Units of contacts.
   
XXV. Materials utilized in connectors
  88. Polymer resins utilized in insulators.
89. Copper-based alloys utilized in contacts.
   
XXVI. Distributor databases
  90. DTAM by distributor
91. Inventory turns by distributor
92. Gross margins by distributor
93. DTAM by product line
94. Shipments of connector manufacturers to distribution
95. Geographic subdivision of DTAM by region and by state
   
XXVII. Manufacturing processes
  96. Manufacturing processes for primary operations (stamping, molding, contact coating)
   
XXVIII. Manufacturing processes of major suppliers (manufacturers)
   
XXIX. Location of manufacturing plants (facilities)
       - North America
     - Europe
     - Japan
     - Pacific Rim
   
XXX. Labor Rates
  97. Labor rates in Mainland China
98. Labor rates in Mexico
   
XXXI. Cost analysis of product designs
   
XXXII. Financial analysis of major suppliers (manufacturers)
   
XXXIII. Connector Counts in electronic equipment
  99. Connector counts (number and type of connector design) in electronic equipment
   
XXXIV. Analysis of sales/marketing functions in major suppliers (manufacturers)
   
XXXV. Analysis of RDE functions in major suppliers (manufacturers)
   
XXXVI. Impact of executive changes within major suppliers (manufacturers)
   
XXXVII. Analysis of non-connector business operations among major suppliers (manufacturers)
   
XXXVIII. Summary databases depicting the “big picture”
  100. Twelve market demand sectors
     - North America
     - Europe
     - Japan
     - Pacific Rim
     - ROW (Rest of World)
  101. 23 product line categories
     - North America
     - Europe
     - Japan
     - Pacific Rim
     - ROW (Rest of World)
  102. Five-year forecast for 12 demand sectors
     - North America
     - Europe
     - Japan
     - Pacific Rim
     - ROW (Rest of World)
  103. Five-year forecast for 23 product line categories
     - North America
     - Europe
     - Japan
     - Pacific Rim
     - ROW (Rest of World)
   
XXXIX. Proprietary Databases
   
XL. Business Issues